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This application note is prepared by ON Semiconductor. ON Semiconductor’s hybrids are miniature thick?film hybrids housing integrated circuits, ceramic chip capacitors, tantalum capacitors and discrete thick?film resistors. The package may use flip chip technology, wire bond technology and surface mount technology to connect various devices to a thick?film substrate. The hybrid inputs and outputs are [...]

This application note from ON SEMICONDUCTOR is is to shed light on the accuracy one can expect to obtain with a given design. All of the error components and their relationship to the overall accuracy of the system are laid out for the user to see and understand. These errors are both random (independent statistically) [...]

This board Level application note for SOD-923 two pin diode package from ON SEMICONDUCTOR is prepared by Steve St. Germain. ON Semiconductor’s SOD-923 represents the latest in small surface mount two pin Diode package technology. Due to the small size of the package, it is important that the mounting process follow the suggested guidelines outlined [...]